{"id":34,"date":"2024-11-07T15:04:29","date_gmt":"2024-11-07T06:04:29","guid":{"rendered":"https:\/\/www.3dicrl.com\/?page_id=34"},"modified":"2024-11-10T12:15:30","modified_gmt":"2024-11-10T03:15:30","slug":"%e3%83%88%e3%83%83%e3%83%97%e3%83%9a%e3%83%bc%e3%82%b8","status":"publish","type":"page","link":"https:\/\/www.3dicrl.com\/","title":{"rendered":"\u30c8\u30c3\u30d7\u30da\u30fc\u30b8"},"content":{"rendered":"\n
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The future of 3D Packaging starts with us<\/span><\/h2>\n<\/div>\n<\/div>\n\n\n\n

We are a pioneering company seamlessly integrating the heterogeneous integration technologies (CoWoS, EMIB) essential for AI semiconductors with Japan\u2019s semiconductor materials ecosystem, setting new standards for excellence in 3DIC packaging.<\/span><\/p>\n\n\n\n

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A Passion for Pioneering New Technology Concepts from Japan<\/span><\/strong><\/h2>\n<\/div>\n<\/div>\n\n\n\n


Our comprehensive range of specialized consulting services meets diverse development needs, from semiconductor equipment and materials to process development.<\/span><\/p>\n\n\n\n

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Research and Study of Advanced Semiconductor Packaging Technologies<\/span><\/h2>\n<\/div>\n\n\n\n
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Proposing Solutions for Processes, Materials, and Equipment<\/span><\/h2>\n<\/div>\n\n\n\n
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Promoting Technical Innovation through Customer Collaboration<\/span><\/h2>\n<\/div>\n<\/div>\n\n\n\n
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Monitoring trends, markets, and technical advancements in the latest packaging technologies (e.g., 3DIC). Collaboration with domestic and international research institutes to access cutting-edge technology.<\/span><\/p>\n<\/div>\n\n\n\n

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Research and recommendations on optimal process technologies (e.g., CoWoS, EmIB). Evaluating and recommending material selections (e.g., bonding, insulation, thermal management) and supporting new equipment introduction.<\/span><\/p>\n<\/div>\n\n\n\n

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Developing solutions for customer-specific technical challenges and creating new packaging concepts. Providing project navigation for product commercialization and optimizing the development process through close communication with customer technical teams.<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

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Collaboration with Japan\u2019s R&D Ecosystem<\/span><\/h2>\n<\/div>\n\n\n\n
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Technical Consulting on 3DIC Technology<\/span><\/h2>\n<\/div>\n\n\n\n
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Creation of Technical Content, Education and Training<\/span><\/h2>\n<\/div>\n<\/div>\n\n\n\n
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Strengthening partnerships with domestic materials and equipment manufacturers, universities, and research institutes to accelerate joint research and development projects.<\/span><\/p>\n<\/div>\n\n\n\n

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Offering 3DIC-related advice, risk assessments, and recommendations for new technology implementations. Providing seminars, lectures, and training to enhance client knowledge.<\/span><\/p>\n<\/div>\n\n\n\n

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Developing technical documents, white papers, and educational electronic content, along with f2f or online trainings and fostering an internal culture of innovation through training programs<\/span>.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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Proven Track Record in Semiconductor Packaging and Collaborative Innovation<\/h2>\n<\/div>\n<\/div>\n\n\n\n

Extensive Experience in Advanced Semiconductor Packaging Development<\/span><\/p>\n\n\n\n

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